1. The infrared temperature sensor can detect the surface temperature of BGA. So the closed-loop control is realized to provide the even heat distribution to the infrared BGA rework station.
2. To obtain the accurate and correct process curve, the RPC is designed to monitor the melting process of BGA solder ball.
3. The PC is connected to the machine via IRSoft to record and analyze the processing procedure, and to form the curve chart for production.
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