Easy to buy
Variety mode of payment
Free shipping
For orders from 3,000,000 VND
Support 24/7
Even outside working hour
Contact Ho Chi Minh City
Tel: (028).3977.8269 / 0906.988.447
Email: sales@lidinco.com
Contact Bac Ninh, Ha Noi City
Tel: (0222).730.0180
Email: bn@lidinco.com
Other Contact: 
★. (1) Use of infrared welding technology which is developed independently.
★. (2) This machine is equipped with laser positioning and adopt 180°rotational lamp structure with flexible operation and easy control. It is suitable for any point of a plat component, especially BGA, SMD component.
★. (3) Break through the traditional hot welder heating element removed cover, thermal shock big shortcoming. Technically use infrared heat lamp. Heat is easy to pierce and distribute evenly. Infrared heating do not have sirocco flow. So do not impact perimeter small component.
★. (4) This machine has 900W heating system. It can be used to unsolder BGA, SMD, CSP, LGA, QFP and PLCC, especially Micro BGA and SMD elements.
★. (5) Don’t need weld tools. This machine can weld all the plat components. Definitely can satisfy the demand to sealing off or repair the BGA of the computer, the notebook and the playstation and so on.
★. (6) Easily operate. Just need one day training to operate this machine.
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