Standard Bonding Machine Engis HWB-12

Descriptions

The HWB series of bonding devices is a simple bonding device used in a wide range of fields.
The cooling table is equipped with a water jacket, which can be connected with a cooling circulation chiller to efficiently cool the waxing plate.
The adhesive pressure is pressed against the synchronized flat plate with a pressurized cylinder to suppress unevenness of wax and apply with good adhesion.