High Speed & High Pressure Lapping Machine Engis EJW-380HSP

Description

The EJW-380HSP series is a polishing machine equipped high-speed and high-pressure process function.
This machine is designed for high-precision and high-efficiency polishing of substrate-shaped polycrystalline sintered diamond (PCD) and CVD diamond. The temperature control system, especially developed for PCD polishing, responds to the temperature rise of the grinding wheel and controls the spindle speed and pressure to maintain the optimum processing temperature.
In addition, many of the next-generation materials are hard, brittle, and difficult-to-cut materials, and the specifications are such that they can withstand severe processing conditions using high pressure and high rotation speeds that achieve high-efficiency polishing.