Large Size Lapping Machine Engis EJW-1200

Description

We have a full line-up of high-precision large-scale lapping machines of various sizes to meet the high-precision lapping required by the mass production of high-value-added parts and the increasing diameter of semiconductor wafers. In addition to the standard facing mechanism, the GNC series, in which the Z-axis is controlled by a servo motor, enables highly accurate flattening of the lapping plate by correcting the straightness of the facing slider and reprocessing of the spiral groove.