Wafer Bonding Machine Engis EBM-200HCD

Description

EBM-250HCD is a equipment designed and developed for bonding wafers and waxing plates (ceramic plates). Solid wax is made into liquid form and a certain amount of wax is supplied by a dispenser according to the wafer size.
In addition, pressurization, heating, and cooling are performed on the same table to control the variation in wafer thickness, flatness, and parallelism due to adhesion.