Reflow Soldering Machine Grandseed GSD-GB822

Description

● In order to prolong the service life of the motor, our company’s technicians professionally designed it; make the internal cooling cycle convection, so that the temperature around the motor drops to about 38°C;

● The high-quality, high-temperature, high-speed motor has smooth wind, low vibration and low noise;

● Professional wind wheel design, stable wind speed, effectively prevent the uniformity of the wind when the PCB board is heated, and achieve the highest repeated heating;

● Each temperature zone adopts forced independent circulation, independent PID control, and upper and lower independent heating methods, so that the temperature of the furnace chamber is accurate and uniform, and the heat capacity is large; the leading heating method solves the problem of dead corners during reflow soldering. Suitable for CSP, BGA, 0201 CHIP Welding of electrical components;

● Online UPS equipped with power failure protection function to ensure the normal output of the PCB board after power failure without damage;

● Independently controlled cooling system, made of imported stainless steel, upper and lower cooling convection, the cooling curve is a mirror image of the welding temperature curve, which is in full compliance with the SMT international certification standard. (Patent No.: ZL 2010 2 0674965.6)

● The insulation layer is made of high-quality aluminum silicate insulation material, and the multi-layer insulation furnace design. The surface temperature of the furnace outer jacket is about 5 degrees higher than the ambient temperature, which effectively reduces the working environment temperature, has good insulation effect, and heats up quickly, from room temperature to working temperature ≤20min; Special furnace design, power consumption is the lowest in the industry;