Reflow Soldering Long Ting RF-835LS

Description

1. Using CHB temperature control meter to control the operation interface of the instrument, PID temperature adjustment, easy to operate: using intelligent control system, the temperature control accuracy is high ± 1-2 ℃, to ensure the stability and reliability of the control system;

2. Equipped with mesh belt tensioning device, stable transportation, no shaking, no deformation, to ensure smooth transportation of PCB;

3. All heating zones are controlled by PID with temperature control table (the 8 temperature zones below the upper 8 temperature zones are independently temperature controlled, and the temperature zones can be opened separately. It can be heated by zone to reduce the starting power);

4. With fault sound and light alarm function;

5. Equipped with leakage protector to ensure the safety of operators and control systems;

6. Built-in board ejection and automatic delay shutdown system to ensure that the PCB and reflow soldering machine will not be damaged when the power is cut off or overheated;

7. Using the world’s leading hot air circulation heating method, the temperature is uniform, the heat compensation efficiency is high, and the high-efficiency pressurized acceleration air duct greatly increases the circulating hot air flow, and the temperature rises quickly (about 20 minutes), with high heat compensation efficiency. High temperature welding and curing;

8. The upper and lower 8 temperature zones are equipped with independent temperature sensing sensors to monitor and compensate the temperature balance of each temperature zone in real time;

9. The quenching system from international technology adopts magnifying glass type centralized and efficient quenching, the cooling speed can reach 3.5~6℃/sec, and the management is very convenient; the external forced cooling device ensures the crystallization effect of solder joints (Option option, standard Configured for forced natural air cooling);

10. Special pressurized air transport structure and special-shaped heating wire design, no noise, no vibration, have a very high heat exchange rate, the temperature difference △t between the bottom of the BGA and the PCB board is extremely small, and it is most in line with the strict lead-free process. requirements, especially for lead-free products with difficult soldering requirements.