Applications:
Semiconductor packaging, glue dropping; PCB electronic parts fixing and protection; LCD glass machine board packaging and bonding; mobile phone board coating or button glue dropping; speaker glue dropping; battery box glue dropping; automobile parts coating glue dropping; hardware parts coating glue dropping; quantitative gas and liquid filling coating Cloth; chip binding and dispensing
Machine features:
- 1. Display screen makes dispensing parameters clear at a glance.
- 2. Delay time and delay time of dispensing can be set at will to eliminate the phenomenon of
- 3. Dual-rod sliding platform cylinder equipped with SMC can make the machine fast and stable in operation, and eliminate the mechanical action error.
- 4. Equipped with X-Y fine-tuning platform, the machine can be positioned accurately and quickly.
- 5. Servo motor and ball screw are used to make dispensing speed high-speed and accurate.
- 6. Built-in precise dispensing controller without external dispensing controller;
- 7. Optional magnetic switch and photoelectric switch make dispensing more humane.
- 8. With dispensing counting and alarming function, the dispensing times can be mastered at any time.
- 9. The gantry mobile structure facilitates fixture installation and product handling.
- 10.It can take aerial photography (U) positioning function.
Specification:
Model | JT-HPD400 |
Working Range X/Y/Z-Axis(mm) | 400*400*100 |
Max Load Y-Z Axis | 10 KG |
Moving speed (mm/sec) | 0.1~600 |
Resolution | 0.01mm/Axis |
Repetitive positioning accuracy | +/-0.01mm/Axis |
Motor system | Japanese Servo Motor |
Driving method | Rolling ball screw |
Interpolation function | 3 axis(3D) |
Programming method | Software (PC) or Control Handle |
I/O Signals port | 8 I/O |
External interface | USB |
Power | AC220V 50/60HZ |
Working temperature | 10~40℃ |
Working relative humidity | 20~90% |
Dimensions(W*D*H) | 980*1523*1630mm |
Weight | 550Kg |