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Used for final polishing, colloidal suspensions are mixtures of abrasive particles dispersed throughout a chemically aggressive liquid carrier. This combination provides a chemical-mechanical polishing action, resulting in deformation-free surfaces. The modified pH of these suspensions can provide delineation of grain boundaries and other microstructural features for some sample types.
The 0.02 micron colloidal silica formula provides ultra-fine surface finishes for demanding SEM/TEM analysis. It is non-crystallizing and has a 9.8 pH.
The 0.05 micron colloidal silica formula is an excellent final polish for a wide variety of materials, especially non-ferrous metals, PCBs and ICs. It is non-crystallizing and has a 9.8 pH
| Item# | Item Name | Qty |
| 180-40015 | Colloidal Silica Suspension, Non-Crystallizing, 0.02 Micron, 16 oz. (480 mL) | |
| 180-40010 | Colloidal Silica Suspension, Non-Crystallizing, 0.02 Micron, 32 oz. (950 mL) | |
| 180-40000 | Colloidal Silica Suspension, Non-Crystallizing, 0.02 Micron, 128 oz. (3.8 L) | |
| 180-20015 | Colloidal Silica Suspension, Non-Crystallizing, 0.05 Micron, 16 oz. (480 mL) | |
| 180-20010 | Colloidal Silica Suspension, Non-Crystallizing, 0.05 Micron, 32 oz. (950 mL) | |
| 180-20000 | Colloidal Silica Suspension, Non-Crystallizing, 0.05 Micron, 128 oz. (3.8 L) |
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