There are many factors affecting the reflow soldering process, which are also very complicated. It requires the process personnel to continuously research and discuss in production, and will be discussed from various aspects.
1. Insulation Section
The holding section refers to the area where the temperature rises from 120 ° C to 150 ° C to the melting point of the solder paste. Its main purpose is to stabilize the temperature of the components in the SMA and minimize the temperature difference. Give enough time in this area to bring the temperature of the larger components to the smaller components and ensure that the flux in the solder paste is fully volatilized. At the end of the holding section, the oxide on the pads, solder balls and component leads are removed and the temperature of the entire board is balanced. It should be noted that all components on the SMA should have the same temperature at the end of this segment, otherwise entering the reflow section will result in various poor soldering phenomena due to uneven temperature in each part.