Infrared BGA Rework System Quick 7610

The QUICK7610 uses infrared sensor technology and is controlled by microprocessor. Infrared temperature sensors and infrared heating tubes are untouchable with precise de-soldering components. The soldering process is monitored by non-contact infrared sensors with good process control at any time. In order to control the soldering process and obtain non-destructive and reproducible PCB temperatures, the QUICK7610 provides 2400W heating power for all applications such as large, small PCB boards and lead-free soldering. Quick7610 uses cycle control reflow soldering technology to ensure precise, small process windows, uniform thermal distribution and a suitable peak temperature for high and reliable lead-free soldering.

Feature:

• No need of nozzles, no airflow in BGA ball process, high rate of success.
• Top dark-infrared open type of heating, large area bottom infrared preheating, decrease the vertical temperature difference between BGA surface and soldering joints, shorten the rework time.
• Use non-contact infrared temperature sensor, full-closed loop control of the temperature of BGA surface, ensure precise temperature process and even heat distribution.
• The PCB fixture can be moved in four directions, easy installation.
• IRSOFT interface with operating authority and profile analysis function.

Specifications: