High Precision Vertical Wafer Grinding Machines Engis EVG-200

HIGH PRECISION VERTICAL GRINDING MACHINES

– The EVG Series Vertical Grinding Machine is designed to grind advanced materials to a high degree of precision in flatness and surface quality, often reducing or eliminating the need for lapping.

– The compact design with advanced controls and process monitoring make this an ideal machine for use in research & development or for pilot line production of advanced components

Some of the ideal applications for the EVG Series:

– Semiconductor wafer grinding or back-thinning (SiC, GaAs, Sapphire, Si, GaN, AlN, InP)

– Semiconductor equipment components (ceramic chucks, glass ceramic)

– Substrates for semiconductor advanced packaging including MEMS (ceramic, polyimide)

The EVG-AD and EVG-ADM models are equipped with controls that provide automated grinding wheel dressing, automated positioning of the grinding wheel relative to the workpiece and workpiece thickness measurement. For maximum control, an upgrade to in-process thickness measurement with feedback to the grinding cycle in real time, is available. The ADM model offers automated thickness options: multipoint contact probing for multiple wafer grinding or a choice of contact or non-contact continuous inprocess measurement for single wafer.

GRINDING WHEEL TECHNOLOGY

The EVG Series machines are equipped with Engis grinding wheels based on the MAD Wheel (Mixed Abrasive Diamond) technology, which tailors the wheel to the material being processed. Consult your Engis application engineer for specific process recommendations for your material.

Engis is a global leader in the design and manufacture of complete lapping and polishing systems that offer the highest quality finished components, processed in the quickest cycle times, while minimizing

manufacturing costs. What really sets us apart from the competition is our unique ability to provide Process Development and Customer Support that is second to none. Our systems are suitable for processing a vast range of materials: metals, ceramics, glass, semiconductor substrates, plastics and other advanced materials. We have developed solutions for many industries, improving quality, efficiency, and cost.

• We offer Products, Service and Technical Support.
• Lapping and Polishing Systems
• Fastlap Machines
• Hyprez Slurries and Diamond Compounds

Specifications

Worktable Chuck Size: ∅200

Wheel Size: ∅250

Interface: Programmble Logic Controller

Workable speed: 400 rpm max, CW & CWW rota

Wheel Speed: 2000 rpm max, CW & CWW rotation

Min feed speed: 6um/min(0.1um/sec), optional: 0.6um/min(0.01um/sec)

Max feed rate: 60um/min (10um/sec)

Worktable Chuck: Vacuum Chuck

Wheel Spindle Bearing: Angular contact bearing

Wheel Spindle Motor: 2kW

Coolant Tank/Pump Flow: 50L/8L/min

Air-Pressure: 0.5~0.8Mpa

Operating Voltage: AC200V+/-10%, 3 phasem 50/60Hz

Dimension: 800x800x1900

Weight: 1000kg