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Vitrox V810i S2EX Advanced 3D X-ray Inspection System (AXI)

Máy kiểm tra PCB bằng tia X Vitrox V810i S2EX

Product information

Manufacturer: Vitrox
Model: V810i S2EX
Warranty: 12 months

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Category: AOI, X-Ray AXI Systems

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Description
Document

World fastest and best test coverage AXI system for PCB SMT assembly line

System	V810i S2 Series
System controller	Integrated controller with 8 Core Intel Xeon processors
Operating system	Windows 10 (64 bits)
Test Development Environment
User interface	Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels
Off-line test development software	Optional for off-line PC
CAD conversion tool	Support 4 different types of CAD in V810i software and optional software available to translate other CAD data to ViTrox’s format
Typical test development time	4 hours to 1.5 days to convert raw CAD file and develop application
Line Integration
Transport heights	865 mm – 1025 mm
Line communication standard	SMEMA, HERMES
Barcode readers	Compatible with most industry standard barcode readers
Performance Parameters *
Typical image acquisition rate	51.68 cm²/sec (8 in²/sec) at 19um
False Call rate	500 – 1000 ppm
Minimum features detection capability
Joint pitch¹	0.3 mm and above
Short width²	0.045 mm
Solder thickness	0.0127 mm
Allowable Panel Characteristics **	V810i S2EX
Maximum PCB Size (L x W)	609.6 mm x482.6 mm (24″x19″)
Minimum PCB Size (L x W)	76.2 mm x 76.2 mm (3″ x 3″ )
Maximum PCB inspectable area	609.6 mm x 474.9 mm (24″x18.7″)
Maximum PCB thickness	7 mm (275 mils)
Minimum PCB thickness	0.5 mm (20 mils)
PCB warp	Downside < 3.3 mm; Upside < 1.5 mm
Maximum PCB weight	4.5kg
Top Clearance of PCB	50 mm @ 23 µm resolution 38 mm @ 19 µm resolution 38 mm @ 10.5 µm resolution# 11 mm @ 11 µm resolution 11 mm @ 6 µm resolution# (Calculated from Board Top surface)
Bottom Clearance of PCB	70 mm
PCB edge clearance	3 mm
100% Press-fit testability	Yes (With PSP2 / PSP2.1 feature)
PCB Temperature	40 Deg C
Power and Environmental
Power Supplies	200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz)
Air requirement	552kPA (80psi)
System footprint (Width X Depth X Height)	1566 mm x 2145 mm x 1972 mm
Total system weight	~3800 kgs
*Note: 1. Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier. 2. Maximum panel size dimensions and weight must include carrier if applicable 3. Smaller panels are possible with the use of panel carriers. 4. With panels of this thickness, imaging results can be affected by PCBA layout. 5. Measured from the bottom of the panel including a maximum warp. Note: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. #2×2 binning camera configuration. Hardware upgrade is required on old system.