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Diamond metal bond blades are composed of an inner metal core and an outer rim. The rim consists of metal mixed with abrasive, cured under high temperature and pressure to bond the matrix together. Metal bonding offers long life and durability.
High Concentration
Recommended for general laboratory sectioning, either low (<1000 RPM) or high (>1000 RPM) speeds.
Low Concentration
Recommended for sectioning very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized. Most commonly used at lower (<1000 RPM) speeds.
| Item# | Item Name | Qty |
| 60-20065 | Wafering Blade, Diamond Metal Bond, High Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm) | |
| 60-20070 | Wafering Blade, Diamond Metal Bond, High Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm) | |
| 60-20075 | Wafering Blade, Diamond Metal Bond, High Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm) | |
| 60-20080 | Wafering Blade, Diamond Metal Bond, High Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm) | |
| 60-20081 | Wafering Blade, Diamond Metal Bond, High Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm) | |
| 60-20084 | Wafering Blade, Diamond Metal Bond, High Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm) | |
| 60-20085 | Wafering Blade, Diamond Metal Bond, Low Concentration, 3″ x .006″ x .5″ (76 x .15 x 12.7 mm) | |
| 60-20090 | Wafering Blade, Diamond Metal Bond, Low Concentration, 4″ x .012″ x .5″ (102 x .31 x 12.7 mm) | |
| 60-20095 | Wafering Blade, Diamond Metal Bond, Low Concentration, 5″ x .015″ x .5″ (127 x .38 x 12.7 mm) | |
| 60-20100 | Wafering Blade, Diamond Metal Bond, Low Concentration, 6″ x .020″ x .5″ (152 x .51 x 12.7 mm) | |
| 60-20101 | Wafering Blade, Diamond Metal Bond, Low Concentration, 7″ x .025″ x .5″ (178 x .64 x 12.7 mm) | |
| 60-20104 | Wafering Blade, Diamond Metal Bond, Low Concentration, 8″ x .030″ x .5″ (203 x .76 x 12.7 mm) |
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