Double Sided Lapping Machine Engis EJD-16B

Description

The EJD series is a double-sided polishing machine that supports a wide range of lapping and CMP processing of conventional abrasives, diamond abrasive, and fixed abrasive plates. The standard full safety cover can also be used in a semiconductor manufacturing environment. In addition, a wide variety of optional functions are available, such as real-time part thickness detection, actual pressure monitor and control, and low-pressure, low-speed descent control of the upper surface lapping platen, which are indispensable for simultaneous double-sided polishing of thin wafers.