Small Size Polishing Machine Engis EJ-300-CMP

Description

The tabletop and stand alone lapping machines are designed with the optimum equipment size to build a polishing process accommodating for lab scale to production scale. In particular, the adoption of a highly rigid body suitable for high-pressure polishing and a uniquely developed water-cooled spindle keeps the temperature of the polishing pad surface constant and achieves high-precision rotation with less vibration.