Description
The tabletop and stand alone lapping machines are designed with the optimum equipment size to build a polishing process accommodating for lab scale to production scale. In particular, the adoption of a highly rigid body suitable for diamond lapping and a uniquely developed water-cooled spindle keeps the surface temperature of the lapping machine constant and achieves high rotational accuracy with less vibration. In addition, by installing a high-precision facing device, the stable surface plate flatness is maintained at all times to achieve ultra-precision lapping.