Description
The RF-B630T inline reflow oven is configured with 6 heating zones followed by cooling section(s). During the SMT reflow soldering process, the zones are programmed with a thermal set point. This set point corresponds to the temperature the circuit board should be exposed to as it passes through that zone.
The soldering process completed automatically after temperature set up. Easy to operate.
- PID Digital Temperature Control System
- High temperature Lead Free Soldering applications up to 400°C
- Horizontal Convection heating technology
- Stainless steel conveyor
- 1060mm Long Heat TunnelUpper 3 Heating Zones + Bottom 3 Heating Zones
- 300mm wide conveyor
- Easy lift clamshell design
- Heat resistance fan
- High-Efficiency and Energy-Saving Heating Tube