FUNCTIONS AZ-600-E-D
Prevention of oxidation, moisture and static electricity in semiconductors and industrial products Extending the shelf life of food products, maintaining freshness, taste and aroma
- When bonding M-shaped envelopes (coffee bags) or thick films, it is possible to bond by heating up and down.
- The entire machine is made of stainless aluminum, so it is rust-free and can be operated in a humid place.
- OIL-LESS PUMP and pneumatic pump allow operation in a clean room and can be used for semiconductor packaging.
- The shelves are height and angle adjustable, so you can easily work with any product. In addition, it can be moved using a stand and can work with heavy or large products.
- A/S procedure is easy by adopting a detachable digital control box, and the control is displayed in Korean or English by adopting LCD (PLC control method), so anyone can easily operate it.
- The vacuum sensor and digital timer function are built-in, and the vacuum level (unit: kpa) and vacuum gas filling time can be finely adjusted. (Time unit: adjustable up to 0.1 second)
- The degree of vacuum can be adjusted arbitrarily by the operator’s judgment without adjusting the vacuum time (using a foot switch).
- Gas filling function can be adopted as an option.
- Space utilization and mobility are maximized with a simple design and minimal weight.
- The highest degree of vacuum among nozzle-type vacuum packaging machines. (Refer to specifications)
- By adopting various optional items, more convenient work is possible.
- The nozzle is inserted into the bag to suck the air in the bag and vacuum it, so the work speed is fast and the operation is simple.
- A single machine can perform various tasks such as vacuum, gas filling, and bonding.
- It is possible to use any product as it can install various optional devices such as imprinter and top/bottom double type heavy shelf.
- When filling gas (CO2, N2, etc.), it is easy to prevent oxidation and corruption of food and semiconductors.