This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps.
The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more. In this way the XM8000 can be used as an integral part of the fabrication and packaging of integra
- High-throughput X-ray metrology and defect review of both optically hidden and visible features of:
2.5D & 3D IC Packages
- Non-destructive in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more
- Industry standard handling of wafers – up to 300 mm
- Non-standard substrate handling versions available